| BS 9325:1977 | Rules for the preparation of detail specifications for semiconductor devices of assessed quality: microwave Gunn oscillators (c.w. operation) |
| BS 9327:1977 | Rules for the preparation of detail specifications for semiconductor devices of assessed quality: microwave avalanche oscillators (c.w. operation) |
| BS 9328:1977 | Rules for the preparation of detail specifications for semiconductor devices of assessed quality: microwave avalanche oscillators (pulse operation) |
| BS 9351:1980 | Rules for the preparation of detail specifications for semiconductor devices of assessed quality: microwave semiconductor switches (without integrated driver circuits) |
| BS CECC 50000:1987 | Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices |
| BS CECC 50000:Supplement No. 1:1983 | Harmonized system of quality assessment for electronic components. Generic specification: discrete semiconductor devices. CECC assessed process average |
| BS EN 60747-15:2004 | Discrete semiconductor devices. Isolated power semiconductor devices |
| BS EN 60747-16-1:2002+A1:2007 | Semiconductor devices. Microwave integrated circuits. Amplifiers |
| BS EN 60747-16-3:2002 | Discrete semiconductor devices and integrated circuits. Microwave integrated circuits. Frequency converters |
| BS EN 60747-16-4:2004 | Discrete semiconductor devices. Microwave integrated circuits. Switches |
| BS EN 62047-1:2006 | Semiconductor devices. Micro-electromechanical devices. Terms and definitions |
| BS EN 62047-2:2006 | Semiconductor devices. Micro-electromechanical devices. Tensile testing method of thin film materials |
| BS EN 62047-3:2006 | Semiconductor devices. Micro-electromechanical devices. Thin film standard test piece for tensile testing |
| BS EN 62258-1:2005 | Semiconductor die products. Requirements for procurement and use |
| BS EN 62258-2:2005 | Semiconductor die products. Exchange data formats |
| BS EN 62258-5:2006 | Semiconductor die products. Requirements for information concerning electrical simulation |
| BS EN 62258-6:2006 | Semiconductor die products. Requirements for information concerning thermal simulation |
| BS EN 62384:2006 | D.C. or A.C. supplied electronic control gear for LED modules. Performance requirements |
| BS IEC 60747-14-3:2001* IEC 60747-14-3:2001 | Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors. Pressure sensors |
| BS IEC 60747-4-2:2000* QC 750116:2000 | Semiconductor devices. Discrete devices. Microwave diodes and transistors. Integrated-circuit microwave amplifiers. Blank detail specification |
| PD CLC/TR 62258-3:2007 | Semiconductor die products. Recommendations for good practice in handling, packing and storage |
| PD IEC/TR 62258-4:2007 | Semiconductor die products. Questionnaire for die users and suppliers |
| PD IEC/TR 62258-7:2007 | Semiconductor die products. XML schema for data exchange |
