| BS 123000:2001 | System of quality assessment. Generic specification. Printed boards |
| BS 123100-003:2001 | System of quality assessment. Capability detail specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS 123100:2001 | System of quality assessment. Sectional specification. Rigid single-sided and double-sided printed boards with plain holes |
| BS 123200-003:2001 | System of quality assessment. Capability detail specification. Rigid double-sided printed boards with plated-through holes |
| BS 123200:2001 | System of quality assessment. Sectional specification. Rigid double-sided printed boards with plated-through holes |
| BS 123300-003:2001 | System of quality assessment. Capability detail specification. Rigid multilayer printed boards |
| BS 123300:2001 | System of quality assessment. Sectional specification. Rigid multilayer printed boards |
| BS 123400-003:2001 | System of quality assessment. Capability detail specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123400:2001 | System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards without through-connections |
| BS 123500-003:2001 | System of quality assessment. Capability detail specification. Flexible Single-sided and double-sided printed boards with through-connections |
| BS 123500:2001 | System of quality assessment. Sectional specification. Flexible single-sided and double-sided printed boards with through-connections |
| BS 123600-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid multilayer printed boards with through-connections |
| BS 123600:2001 | System of quality assessment. Sectional specification. Flex-rigid multilayer printed boards with through-connections |
| BS 123700-003:2001 | System of quality assessment. Capability detail specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123700:2001 | System of quality assessment. Sectional specification. Flex-rigid double-sided printed boards with through-connections |
| BS 123800-003:2001 | System of quality assessment. Capability detail specification. Flexible multilayer printed boards with through-connections |
| BS 123800:2001 | System of quality assessment. Sectional specification. Flexible multilayer printed boards with through-connections |
| BS 231:1975 | Specification for pressboard for electrical purposes |
| BS 4584-103.1:1990* IEC 60249-3-1:1981 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board |
| BS 4584-103.2:1990* IEC 60249-3A:1976 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for copper foil for use in the manufacture of copper-clad base materials |
| BS 4584-103.3:1992* IEC 60249-3-3:1991 | Metal-clad base materials for printed wiring boards. Special materials used in connection with printed circuits. Specification for permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| BS 4584-13:1977 | Specification for metal-clad base materials for printed circuits. Silicone woven glass fabric copper-clad laminated sheet Si-GC-Cu-13 |
| BS 4584-15:1978 | Metal-clad base materials for printed wiring boards. Adhesive coated polymeric films: PETP-F-15 and PI-F-15 |
| BS 4584-5:1972 | Specification for metal-clad base materials for printed circuits. Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality: PF-CP-Cu-5 |
| BS 4584-6:1972 | Specification for metal-clad base materials for printed circuits. Phenolic cellulose paper copper-clad laminated sheet of medium electrical quality, flame retardant grade: PF-CP-Cu-6 |
| BS 4584:Part 102:Section 102.5:1990* IEC 60249-2-5:1987 | Metal-clad base materials for printed wiring boards. Copper-clad base materials. Specification for epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS 4584:Part 102:Section 102.6:1990* IEC 60249-2-6:1985 | Metal-clad base materials for printed wiring boards. Copper-clad base materials. Specification for phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test) |
| BS 4584:Part 102:Section 102.7:1990* IEC 60249-2-7:1987 | Metal-clad base materials for printed wiring boards. Copper-clad base materials. Specification for phenolic cellulose copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS 4727-1:Group 11:1991* IEC 60194:1988 | Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms. Terms common to power, telecommunications and electronics. Printed circuits |
| BS 5917:1980 | Specification for conformal coating material for use on printed circuit assemblies |
| BS 6096:Part 1:1981 | Marking inks and solder resist coating materials for printed circuits. Methods of test |
| BS 6096:Part 2:1981 | Marking inks and solder resist coating materials for printed circuits. Specification for marking inks |
| BS 6221-10:1991* IEC 60326-10:1991 | Printed wiring boards. Specification for flex-rigid double-sided printed boards with through connections |
| BS 6221-11:1991* IEC 60326-11:1991 | Printed wiring boards. Specification for flex-rigid multilayer printed boards with through connections |
| BS 6221-12:1992* IEC 60326-12:1992 | Printed wiring boards. Specification for mass lamination panels (semi-manufactured multilayer printed boards) |
| BS 6221-1:1990* IEC 60326-1:1984 | Printed wiring boards. Guide for the specification writer |
| BS 6221-20:1984 | Printed wiring boards. Guide for the assembly of printed wiring boards |
| BS 6221-21:1984 | Printed wiring boards. Guide for the repair of printed wiring boards |
| BS 6221-21:2001 | Printed wiring boards. Guide to the rework of unassembled boards |
| BS 6221-22:1990 | Printed wiring boards. Guide to the use of printed wiring board substrate materials: surface mount technology |
| BS 6221-23:1991 | Printed wiring boards. Guide for the design and use of printed wiring boards: surface mounted devices |
| BS 6221-24:1992* IEC 60321-3:1990 | Printed wiring boards. Guide for the production of artwork |
| BS 6221-25:2000 | Printed wiring boards. Guide to the rework and repair of soldered surface mounted printed board assemblies |
| BS 6221-2:1991* IEC 60326-2:1990 | Printed wiring boards. Methods of test |
| BS 6221-3:1991* IEC 60326-3:1991 | Printed wiring boards. Guide for the design and use of printed wiring boards |
| BS 6221-4:1982* IEC 60326-4:1980 | Printed wiring boards. Method for specifying single and double sided printed wiring boards with plain holes |
| BS 6221-5:1982* IEC 60326-5:1980 | Printed wiring boards. Specification for single and double sided rigid printed boards with plated-through holes |
| BS 6221-6:1982* IEC 60326-6:1980 | Printed wiring boards. Specification for multilayer printed wiring boards |
| BS 6221-7:1982* IEC 60326-7:1981 | Printed wiring boards. Method for specifying single and double sided flexible printed wiring boards without through connections |
| BS 6221-8:1982* IEC 60326-8:1981 | Printed wiring boards. Method for specifying single and double sided flexible printed wiring boards with through connections |
| BS 6221-9:1991* IEC 60326-9:1991 | Printed wiring boards. Specification for flexible multilayer boards with through connections |
| BS 6943:1988 | Classification of shapes of electronic components for placement on printed wiring boards |
| BS 7588:1993 | Guide to hierarchical interconnection technology |
| BS 9526:1977 | Rules for the preparation of detail specifications for electrical edge socket connectors of assessed quality - full and basic assessment level |
| BS 9760:1977 | Specification for printed circuits of assessed quality: generic data and methods of test: capability approval procedure and rules |
| BS 9761:1988 | Sectional specification for capability approval of manufacturers of multilayer rigid printed wiring boards of assessed quality with plated through holes |
| BS 9762:1988 | Sectional specification for capability approval of manufacture of double-sided rigid printed wiring boards of assessed quality with plated through holes |
| BS 9763:1988 | Sectional specification for capability approval of manufacturers of single- or double-sided printed wiring boards of assessed quality without plated through holes |
| BS 9764:1988 | Sectional specification for capability approval of manufacturers of single- or double-sided flexible printed wiring boards of assessed quality without through hole connections and with or without rigidizing component materials |
| BS 9765:1988 | Sectional specification for capability approval of manufacturers of double-sided flexible printed wiring boards of assessed quality with through hole connections and with or without rigidizing component materials |
| BS 9766:1983 | Specification for printed circuits of assessed quality: sectional specification for multilayer flexi-rigid printed circuits with through hole connections |
| BS CECC 123400-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| BS CECC 123500-003:1994 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
| BS CECC 200025:1998 | Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities |
| BS CECC 23100-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes |
| BS CECC 23100-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plain holes |
| BS CECC 23200-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plated through holes |
| BS CECC 23200-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double-sided printed boards with plated through holes |
| BS CECC 23300-003:1996 | Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
| BS CECC 23300-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: multi-layer printed boards |
| BS CECC 23600-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid multilayer printed boards with through connections |
| BS CECC 23700-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: flex-rigid double-sided printed boards with through connections |
| BS CECC 23800-801:1998 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible multilayer printed boards with through connections |
| BS CECC 265001:1998 | Harmonized system of quality assessment for electronic components. Technology approval schedule. Film and hybrid integrated circuits |
| BS EN 123000:1992 | Harmonized system of quality assessment for electronic components. Generic specification: printed boards |
| BS EN 123100-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: single and double sided printed boards with plain holes |
| BS EN 123100:1992 | Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plain holes |
| BS EN 123200-800:1992 | Harmonized system of quality assessment for electronic components: capability detail specification: single and double sided printed boards with plated-through holes |
| BS EN 123200:1992 | Harmonized system of quality assessment for electronic components: Sectional specification: Single and double sided printed boards with plated through holes |
| BS EN 123300-800:1992 | Specification for harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards |
| BS EN 123300:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards |
| BS EN 123400-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards without through-connections |
| BS EN 123400:1992 | Harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards without through connections |
| BS EN 123500-800:1992 | Harmonized system of quality assessment for electronic components. Capability detail specification: flexible printed boards with through-connections |
| BS EN 123500:1992 | Specification for harmonized system of quality assessment for electronic components. Sectional specification: flexible printed boards with through connections |
| BS EN 123600:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid multilayer printed boards with through connections |
| BS EN 123700:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flex-rigid double sided printed boards with through connections |
| BS EN 123800:1997 | Harmonized system of quality assessment for electronic components. Sectional specification. Flexible multilayer printed boards with through connections |
| BS EN 160100:1998 | Harmonized system of quality assessment for electronic components. Sectional specification: capability approval of manufacturers of printed board assemblies of assessed quality |
| BS EN 160101:1998 | Harmonized system of quality assessment for electronic components. Blank detail specification: printed board assembly modular electronic units of assessed quality. Capability approval |
| BS EN 60097:1993* IEC 60097:1991 | Specification for grid systems for printed circuits |
| BS EN 60194:2006 | Printed board design, manufacture and assembly. Terms and definitions |
| BS EN 60249-1:1993* IEC 60249-1:1982 | Base materials for printed circuits. Base materials for printed circuits. Test methods |
| BS EN 60249-2-10:1994* IEC 60249-2-10:1987 | Specifications. Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test). Specification No.10: Epoxide non-woven/ woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 60249-2-11:1994* IEC 60249-2-11:1987 | Specifications. Specification for thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards |
| BS EN 60249-2-12:1994* IEC 60249-2-12:1987 | Specifications. Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards. Specification No.12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards |
| BS EN 60249-2-13:1994* IEC 60249-2-13:1987 | Base material for printed circuits. Specifications. Flexible copper-clad polyimide film, general purpose grade |
| BS EN 60249-2-14:1994* IEC 60249-2-14:1988 | Specifications. Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality |
| BS EN 60249-2-15:1994* IEC 60249-2-15:1987 | Specifications. Flexible copper-clad polyimide film, of defined flammability |
| BS EN 60249-2-16:1993* IEC 60249-2-16:1992 | Specifications. Specification No. 16. Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test). Specification No.16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 60249-2-17:1993* IEC 60249-2-17:1992 | Specifications. Specification No. 17. Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards. Specification No.17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards |
| BS EN 60249-2-18:1993* IEC 60249-2-18:1992 | Specifications. Specification No. 18. Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test). Specification No.18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 60249-2-19:1993* IEC 60249-2-19:1992 | Specifications. Specification No. 19. Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards |
| BS EN 60249-2-1:1994* IEC 60249-2-1:1985 | Specifications. Specification for phenolic cellulose paper copper-clad laminated sheet, high electrical quality. Specification No.1 Phenollic cellulose paper coper-clad laminated sheet, high electrical quality |
| BS EN 60249-2-2:1994* IEC 60249-2-2:1985 | Specifications. Specification for phenolic cellulose paper copper-clad laminated sheet, economic quality. Specification No 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality |
| BS EN 60249-2-3:1994* IEC 60249-2-3:1987 | Specifications. Metal-clad base materials for printed wiring boards. Copper-clad base material. Specification for epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 60249-2-4:1994* IEC 60249-2-4:1987 | Specifications. Specification for epoxide woven glass fabric copper-clad laminated sheet, general purpose grade. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade |
| BS EN 60249-2-5:1994* IEC 60249-2-5:1987 | Specifications. Specification No 5. Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test). Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet, of defined flammability (Vertical burning test) |
| BS EN 60249-2-6:1994* IEC 60249-2-6:1985 | Specifications. Specification No.6. Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test). Specification No.6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test) |
| BS EN 60249-2-7:1994* IEC 60249-2-7:1987 | Specifications. Specification No.7. Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test). Specification No.7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 60249-2-8:1995* IEC 60249-2-8:1987 | Specifications. Specification for flexible copper-clad polyester (PETP) film |
| BS EN 60249-2-9:1994* IEC 60249-2-9:1987 | Specifications. Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test). Specification No.9:Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test) |
| BS EN 61076-4-114:2003 | Connectors for electronic equipment. Printed board connectors with assessed quality. Detail specification for two-part connector with integrated shielding function having a grid of 1 mm x 1,5 mm |
| BS EN 61086-1:1995* IEC 61086-1:1992 | Specification for loaded printed wire boards (conformal coatings). Definitions, classification and general requirements |
| BS EN 61086-1:2004 | Coatings for loaded printed wire boards (conformal coatings). Definitions, classification and general requirements |
| BS EN 61086-2:1995* IEC 61086-2:1992 | Specification for loaded printed wire boards (conformal coatings). Methods of test |
| BS EN 61086-3-1:1995* IEC 61086-3-1:1995 | Specification for loaded printed wire boards (conformal coatings). Coatings for loaded printed wire boards (conformal coatings). Part 3. Specifications for individual materials. Coatings for general purpose (class I) and for high reliability (class II) |
| BS EN 61086-3-1:2004 | Coatings for loaded printed wire boards (conformal coatings). Specifications for individual materials. Coatings for general purpose (class 1), high reliability (class 2) and aerospace (class 3) |
| BS EN 61182-7:1996* IEC 61182-7:1995 | Printed boards. Electronic data description and transfer. Bare board electric test information in digital form |
| BS EN 61188-1-1:1997* IEC 61188-1-1:1997 | Printed boards and assemblies. Design and use. Generic requirements. Flatness considerations for electronic assemblies |
| BS EN 61188-1-2:1998* IEC 61188-1-2:1998 | Printed boards and assemblies. Design and use. Generic requirements. Generic requirements. Controlled impedance |
| BS EN 61188-5-1:2002 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Attachment (land/joint) considerations. Generic requirements |
| BS EN 61188-5-2:2003 | Printed boards and assemblies. Design and use. Attachment (land/joint) considerations. Discrete components |
| BS EN 61188-5-3:2007 | Printed boards and printed board assemblies. Design and use. Attachment (land/joint) considerations. Components with gull- wing leads on two sides |
| BS EN 61188-5-4:2007 | Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Components with J leads on two sides |
| BS EN 61188-5-5:2007 | Printed boards and printed board assemblies. Design and use. Attachment (land/joint) considerations. Components with gull- wing leads on four sides |
| BS EN 61188-5-8:2008 | Printed boards and printed board assemblies. Design and use. Attachments (land/joint) considerations. Area array components (BGA, FBGA, CGA, LGA) |
| BS EN 61189-1:1997* IEC 61189-1:1997 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. General test methods and methodology |
| BS EN 61189-2:1997* IEC 61189-2:1997 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures |
| BS EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for materials for interconnection structures |
| BS EN 61189-3:1997* IEC 61189-3:1997 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards) |
| BS EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies. Test methods for interconnection structures (printed boards) |
| BS EN 61189-6:2006 | Test methods for electrical materials, interconnection structures and assemblies. Test methods for materials used in manufacturing electronic assemblies |
| BS EN 61191-1:1999* IEC 61191-1:1998 | Printed board assemblies. Generic specification. Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| BS EN 61191-2:1999* IEC 61191-2:1998 | Printed board assemblies. Sectional specification. Requirements for surface mount soldered assemblies |
| BS EN 61191-3:1999* IEC 61191-3:1998 | Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies |
| BS EN 61191-4:1999* IEC 61191-4:1998 | Printed board assemblies. Sectional specification. Requirements for terminal soldered assemblies |
| BS EN 61193-1:2002* IEC 61193-1:2001 | Quality assessment systems. Registration and analysis of defects on printed board assemblies |
| BS EN 61249-2-10:2003 | Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-11:2003 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-12:1999* IEC 61249-2-12:1999 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide non-woven aramid laminate of defined flammability, copper-clad. Epoxide non woven aramid laminate of defined flammability, copper-clad |
| BS EN 61249-2-13:1999* IEC 61249-2-13:1999 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Cyanate ester non-woven aramid laminate of defined flammability, copper-clad. Cyanate ester non-woven aramid laminate of defined flammability copper-clad |
| BS EN 61249-2-18:2002* IEC 61249-2-18:2002 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper clad. Section 18: Polyester non-woven fiberglass laminated sheet of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-19:2002* IEC 61249-2-19:2001 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test) copper clad |
| BS EN 61249-2-1:2005 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad |
| BS EN 61249-2-21:2003 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-22:2005 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-23:2005 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper-clad |
| BS EN 61249-2-26:2005 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-2:2005 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad |
| BS EN 61249-2-4:2002* IEC 61249-2-4:2001 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-5:2003 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-6:2003 | Materials for printed boards and other interconnecting structures. Reinforced base materials, clad and unclad. Brominated epoxide non-woven/woven E-glass glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-7:2002 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-8:2003 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Reinforced base materials clad and unclad. Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-2-9:2003 | Materials for interconnection structures. Sectional specification set for reinforced base materials, clad and unclad. Reinforced base materials clad and unclad. Bismaleimide/triazine, modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad |
| BS EN 61249-3-3:1999* IEC 61249-3-3:1999 | Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyester film. Adhesive coated flexible polyester film |
| BS EN 61249-3-4:1999* IEC 61249-3-4:1999 | Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Adhesive coated flexible polyimide film. Adhesive coated flexible polyimide film |
| BS EN 61249-3-5:1999* IEC 61249-3-5:1999 | Materials for interconnection structures. Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards). Transfer adhesive films for flexible printed boards. Transfer adhesive film |
| BS EN 61249-4-11:2005 | Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad. Non-halogenated epoxide woven E-glass prepeg of defined flammability |
| BS EN 61249-4-12:2005 | Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad. Non-halogenated multifuctional epoxide woven E-glass prepeg of defined flammability |
| BS EN 61249-4-2:2005 | Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad. Multifunctional expoxide woven E-glass prepeg of defined flammability |
| BS EN 61249-4-5:2005 | Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials, unclad Polymide, modified or unmodified, woven E-glass prepeg of defined flammability |
| BS EN 61249-5-1:1996* IEC 61249-5-1:1995 | Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Copper foils (for the manufacture of copper-clad base materials) |
| BS EN 61249-5-4:1997* IEC 61249-5-4:1996 | Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings. Conductive inks |
| BS EN 61249-7-1:1996* IEC 61249-7-1:1995 | Materials for interconnection structures. Sectional specification set for restraining core materials. Copper/invar/copper |
| BS EN 61249-8-7:1997* IEC 61249-8-7:1996 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Marking legend inks |
| BS EN 61249-8-8:1997* IEC 61249-8-8:1997 | Materials for interconnection structures. Sectional specification set for non-conductive films and coatings. Temporary polymer coatings |
| BS EN 62326-1:1997* IEC 62326-1:1996* QC 230000:1996 | Printed boards. Generic specification |
| BS EN 62326-1:2002 | Printed boards. Generic specification |
| BS EN 62326-4-1:1997* IEC 62326-4-1:1996* QC 230401:1996 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification. Capability detail specification. Performance levels, A, B and C |
| BS EN 62326-4:1997* IEC 62326-4:1996* QC 230500:1996 | Printed boards. Rigid multilayer printed boards with interlayer connections. Sectional specification |
| BS IEC 61182-2:2006 | Printed board assembly products. Manufacturing description data and transfer methodology. Generic requirements |
| BS QC 200012:1996* CECC 200012:1996 | Process assessment schedule for printed board design facilities |
| DD IEC/PAS 61249-3-1:2007 | Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types) |
| DD IEC/PAS 62326-7-1:2007 | Performance guide for single- and double-sided flexible printed wiring boards |
