| BS 3363:1980* IEC 60148:1969 | Specification for letter symbols for semiconductor devices and integrated microcircuits |
| BS 3363:Supplement No. 1:1981* IEC 60148A:1974 | Specification for letter symbols for semiconductor devices and integrated microcircuits |
| BS 3363:Supplement No. 2:1981* IEC 60148B:1979 | Specification for letter symbols for semiconductor devices and integrated microcircuits |
| BS 3934-10:1992 | Mechanical standardization of semiconductor devices. Schedule of UK national drawings giving dimensions |
| BS 3934-1:1992 | Mechanical standardization of semiconductor devices. Recommendations for the preparation of drawings of semiconductor devices |
| BS 3934-3:1992 | Mechanical standardization of semiconductor devices. Recommendations for the preparation of outline drawings of integrated circuits |
| BS 3934-4:1992* IEC 60191-4:1987 | Mechanical standardization of semiconductor devices. Recommendations for a coding system and classification into forms of package outlines for semiconductor devices |
| BS 3934-5:1997* IEC 60191-5:1997 | Mechanical standardization of semiconductor devices. Recommendations applying to tape automated bonding (TAB) of integrated circuits |
| BS 3934-6:1992* IEC 60191-6:1990 | Mechanical standardization of semiconductor devices. Specification for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS 3934:Part 5:1992* IEC 60191-5:1987 | Mechanical standardization of semiconductor devices. Recommendations for tape automated bonding (TAB) of integrated circuits |
| BS 3939:Part 5:1985* IEC 60617-5:1983 | Graphical symbols for electrical power, telecommunications and electronics diagrams. Semiconductors and electron tubes |
| BS 4727-1:Group 05:1985 | Glossary of electrotechnical, power, telecommunication, electronics, lighting and colour terms. Terms common to power, telecommunications and electronics. Semiconductor terminology |
| BS 6493-1.1:1984* IEC 60747-1:1983 | Semiconductor devices. Discrete devices. General |
| BS 6493-3:1985* IEC 60749:1984 | Semiconductor devices. Mechanical and climatic test methods |
| BS 7237:1990* IEC 60559:1989 | Specification for binary floating point arithmetic for microprocessor systems |
| BS 7241:1989* IEC 60822:1988 | Specification for IEC 822 VSB: parallel sub-system bus of the IEC 821 VME bus |
| BS 7302:1990* IEC 60975:1989 | Specification for microprocessor universal format object modules |
| BS 9300:1969 | Specification for semiconductor devices of assessed quality: generic data and methods of test |
| BS CECC 00013:1985 | Harmonized system of quality assessment for electronic components: basic specification: scanning electron microscope inspection of semiconductor dice |
| BS EN 153000:1998 | Harmonized system of quality assessment for electronic components. Generic specification: discrete pressure contact power semiconductor devices (qualification approval) |
| BS EN 60191-3:2000* IEC 60191-3:1999 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of integrated circuits |
| BS EN 60191-4:2000* IEC 60191-4:1999 | Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages |
| BS EN 60191-6-10:2003 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Dimensions of P-VSON |
| BS EN 60191-6-12:2002 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitch land grid array (FLGA). Rectangular type |
| BS EN 60191-6-13:2007 | Mechanical standardization of semiconductor devices. Design guideline of open-top-type sockets for fine-pitch ball grid array and fine-pitch land grid array (FBGA/FLGA) |
| BS EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices. Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| BS EN 60191-6-1:2001* IEC 60191-6-1:2001 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for gull-wing lead terminals |
| BS EN 60191-6-2:2002* IEC 60191-6-2:2001 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for 1,50 mm, 1, 27 mm and 1,00 mm pitch ball and column terminal packages |
| BS EN 60191-6-3:2001* IEC 60191-6-3:2001 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of quad flat packs (QFP) |
| BS EN 60191-6-4:2003 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of ball grid array (BGA) |
| BS EN 60191-6-5:2001* IEC 60191-6-5:2001 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine-pitchball grid array (FBGA) |
| BS EN 60191-6-6:2001* IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for fine pitch land grid array (FLGA). Proposed amendment on terminology |
| BS EN 60191-6-8:2001* IEC 60191-6-8:2001 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for glass sealed ceramic quad flatpack (G-QFP) |
| BS EN 60191-6:2004 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS EN 60269-4:1996* BS 88-4:1988 | Low-voltage fuses. Supplementary requirements for fuse-links for the protection of semiconductor devices |
| BS EN 60617-5:1996* IEC 60617-5:1996 | Graphical symbols for diagrams. Semiconductors and electron tubes |
| BS EN 60749-10:2002 | Semiconductor devices. Mechanical and climatic test methods. Mechanical shock |
| BS EN 60749-11:2002 | Semiconductor devices. Mechanical and climatic test methods. Rapid change of temperature. Two-fluid-bath method |
| BS EN 60749-12:2002 | Semiconductor devices. Mechanical and climatic test methods. Vibration, variable frequency |
| BS EN 60749-13:2002 | Semiconductor devices. Mechanical and climatic test methods. Salt atmosphere |
| BS EN 60749-14:2003 | Semiconductor devices. Mechanical and climatic test methods. Robustness of terminations (lead integrity) |
| BS EN 60749-15:2003 | Semiconductor devices. Mechanical and climatic test methods. Resistance to soldering temperature for through-hole mounted devices |
| BS EN 60749-16:2003 | Semiconductor devices. Mechanical and climatic test methods. Particle impact noise detection (PIND) |
| BS EN 60749-17:2003 | Semiconductor devices. Mechanical and climatic test methods. Neutron irradiation |
| BS EN 60749-18:2003 | Semiconductor devices. Mechanical and climatic test methods. Ionizing radiation (total dose) |
| BS EN 60749-19:2003 | Semiconductor devices. Mechanical and climatic test methods. Die shear strength |
| BS EN 60749-1:2003 | Semiconductor devices. Mechanical and climatic test methods. General |
| BS EN 60749-20:2003 | Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat |
| BS EN 60749-21:2005 | Semiconductor devices. Mechanical and climatic test methods. Solderability |
| BS EN 60749-22:2003 | Semiconductor devices. Mechanical and climatic test methods. Bond strength |
| BS EN 60749-23:2004 | Semiconductor devices. Mechanical and climatic test methods. High temperature operating life |
| BS EN 60749-24:2004 | Semiconductor devices. Mechanical and climatic test methods. Accelerated moisture resistance. Unbiased HAST |
| BS EN 60749-25:2003 | Semiconductor devices. Mechanical and climatic test methods. Temperature cycling |
| BS EN 60749-26:2006 | Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM) |
| BS EN 60749-27:2006 | Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Machine model (MM) |
| BS EN 60749-29:2003 | Semiconductor devices. Mechanical and climatic test methods. Latch-up test |
| BS EN 60749-2:2002 | Semiconductor devices. Mechanical and climatic test methods. Low air pressure |
| BS EN 60749-30:2005 | Semiconductor devices. Mechanical and climatic test methods. Preconditioning of non-hermetic surface mount devices prior to reliability testing |
| BS EN 60749-31:2003 | Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (internally induced) |
| BS EN 60749-32:2003 | Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced) |
| BS EN 60749-33:2004 | Semiconductor devices. Mechanical and climatic test methods. Accelerated moisture resistance. Unbiased autoclave |
| BS EN 60749-34:2004 | Semiconductor devices. Mechanical and climatic test methods. Power cycling |
| BS EN 60749-35:2006 | Semiconductor devices. Mechanical and climatic test methods. Acoustic microscopy for plastic encapsulated electronic components |
| BS EN 60749-36:2003 | Semiconductor devices. Mechanical and climatic test methods. Acceleration, steady state |
| BS EN 60749-37:2008 | Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using an accelerometer |
| BS EN 60749-39:2006 | Semiconductor devices. Mechanical and climatic test methods. Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components |
| BS EN 60749-3:2002 | Semiconductor devices. Mechanical and climatic test methods. External visual examination |
| BS EN 60749-4:2002 | Semiconductor devices. Mechanical and climatic test methods. Damp heat, steady state, highly accelerated stress test (HAST) |
| BS EN 60749-5:2003 | Semiconductor devices. Mechanical and climatic test methods. Steady-state temperature humidity bias life test |
| BS EN 60749-6:2002 | Semiconductor devices. Mechanical and climatic test methods. Storage at high temperature |
| BS EN 60749-7:2002 | Semiconductor devices. Mechanical and climatic test methods. Internal moisture content measurement and the analysis of other residual gases |
| BS EN 60749-8:2003 | Semiconductor devices. Mechanical and climatic test methods. Sealing |
| BS EN 60749-9:2002 | Semiconductor devices. Mechanical and climatic test methods. Permanence of marking |
| BS EN 60749:1999* IEC 60749:1996 | Semiconductor devices. Mechanical and climatic test methods |
| BS IEC 60191-1:2007 | Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of discrete devices |
| BS IEC 60191-2:1966 | Mechanical standardization of semiconductor devices. Dimensions |
| BS IEC 60747-14-1:2000 | Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors. General and classification. Sensor generals and classification for semiconductor sensors |
| BS IEC 60747-14-2:2000 | Discrete semiconductor devices and integrated circuits. Semiconductor devices. Semiconductor sensors. Hall elements |
| BS IEC 60747-16-2:2001* IEC 60747-16-2:2001 | Semiconductor devices. Microwave integrated circuits. Frequency prescalers |
| BS IEC 60747-1:2006 | Semiconductor devices. General |
| BS IEC 60747-5-4:2006 | Semiconductor devices. Discrete devices. Optoelectronic devices. Semiconductor lasers |
| BS IEC 796-1:1990 | Microprocessor system bus. 8-bit and 16-bit data MULTIBUS I. Functional description with electrical and timing specifications |
| BS QC 700000:1991* IEC 60747-10:1991 | Harmonized system of quality assessment for electric components. Generic specification for discrete devices and integrated circuits |
| BS QC 750100:1986* IEC 60747-11:1985 | Harmonized system of quality assessment for electronic components. Discrete semiconductor devices. Sectional specification |
| DD IEC/PAS 62050:2004 | Board level drop test method of components for handheld electronicproduc ts |
| DD IEC/PAS 62483:2006 | Test method for measuring whisker growth on tin and tin alloy surface finishes |
| PD 6460:1971 | Collected amendments to the CV7000 specifications for semiconductors adopted as British Standards (9300C series) |
| PD ES 59008-1:2000* ES 59008-1:1999 | Data requirements for semiconductor die. General requirements |
| PD ES 59008-2:1999 | Data requirements for semiconductor die. Vocabulary |
| PD ES 59008-3:1999 | Data requirements for semiconductor die. Mechanical, material and connectivity requirements |
| PD ES 59008-4-1:2001* ES 59008-4-1:2000 | Data requirements for semiconductor die. Specific requirements and recommendations. Test and quality |
| PD ES 59008-4-2:2001* ES 59008-4-2:2000 | Data requirements for semiconductor die. Specific requirements and recommendations. Handling and storage |
| PD ES 59008-4-3:2000* ES 59008-4-3:1999 | Data requirements for semiconductor die. Specific requirements and recommendations. Thermal |
| PD ES 59008-4-4:2000* ES 59008-4-4:1999 | Data requirements for semiconductor die. Specific requirements and recommendations. Electrical simulation |
| PD ES 59008-5-1:2001* ES 59008-5-1:2001 | Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die |
| PD ES 59008-5-2:2001* ES 59008-5-2:2001 | Data requirements for semiconductor die. Particular requirements and recommendations for die types. Bare die with added connection structures |
| PD ES 59008-5-3:2001* ES 59008-5-3:2001 | Data requirements for semiconductor die. Particular requirements and recommendations for die types. Minimally-packaged die |
| PD ES 59008-6-1:1999 | Data requirements for semiconductor die. Exchange data formats and data dictionary. Data exchange. DDX file format |
| PD ES 59008-6-2:2001 | Data requirements for semiconductor die. Exchange data formats and data dictionary. Data dictionary |
| PD IEC TR 62380:2004 | Reliability data handbook. Universal model for reliability prediction of electronics components, PCBs and equipment |
| PD IEC/PAS 62240:2001* IEC/PAS 62240:2001 | Use of semiconductor devices outside manufacturer's specified temperature ranges |
